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- ¸ðµ¨ ¹øÈ£: AS3000-SD-eMCP162/186-B01
- Color: Black Version
- Interface: SD Version
- Application: Mobile chip-off Data recovery Restore Retrieve restore
- Support: eMCP Memory, Dead Water/physical damaged broken phone
- Temperature: -55~+175celsius
- Data recovery: Contact SMS Video Photo App data etc
- eMMC/eMCP Memory: Most Andriod Mobile, Samsung LG HTC Nokia Micromax Sony ect. Smartphon
- Socket model: FBGA162 BGA186 eMCP162 eMCP186
- Memory chip Dimension: 9x11mm 11x10mm 11.5x13mm 12x16mm 12x18mm 14x18mm
- Nand Flash Memory: Kingston, Samsung, Sandisk, icron, HTC, MTK, Intel, Infineon, Skhynix,
Bga162/186 fbga ¸®´õ emcp162-186-SD ¾î´ðÅÍ Àб⠾²±â ÇÁ·Î±×·¡¹Ö ¼ÒÄÏEmmc/emcp ¼ÒÄÏ/¸®´õ´Â ¹«¾ùÀԴϱî?.Emmc/emcp-sd ¼ÒÄÏ emmc/emcp ÀÐ±â ¹× ¾²±â (ÇÁ·Î±×·¡¹Ö), bga/fbga nand Ç÷¡½Ã, ´ëºÎºÐÀÇ ¾Èµå·ÎÀÌµå ¸ð¹ÙÀÏ ¸Þ¸ð¸® Ĩ ¿ÀÇÁ º¹±¸, samsung, hynix, sandisk, toshiba, intel, kingston µî°ú °°Àº ¸¹Àº ºê·£µå emmc/emcp ¸Þ¸ð¸®¸¦ Áö¿øÇÕ´Ï´Ù. Nencrypted emmc/emcp ¸Þ¸ð¸® ch¿¡¼ ¿¬¶ôó/sms/»çÁø/ºñµð¿À/ÅëÈ ·Î±×/¾Û µ¥ÀÌÅ͸¦ ÃßÃâIp, ¸ð¹ÙÀÏ ¹° ¼Õ»ó, ±Õ¿, ±úÁø ¶Ç´Â ´Ù¸¥ ¹°¸®Àû ¼Õ»ó (¸¶´õ º¸µå Á×Àº/¼Õ»ó µÉ ¼ö ÀÖÁö¸¸, ¸Þ¸ð¸® Ĩ ¿©ÀüÈ÷ ÁÁÀº »óÅ¿¡ ÀÖ´ÂÁö È®ÀÎ). Samsung, lg, sony, blackberry, nokia, huawei, mi, htc, motorola, asus, acer, lenovo, zte, vivo, oppo, hisense, coolpad, k-touch, tomtom ect.(»ï¼º s6 s7 ½Ã¸®Áî ¸ð¹ÙÀÏ ¹× ±âŸ ufs ÆÐÅ°Áö Ĩ¿¡¼ ufs2.0 ¸Þ¸ð¸®¿¡ ÀûÇÕÇÏÁö ¾ÊÀ½)´õ ¸¹Àº ÀüÈ mobel ¹× ±â¾ï ĨÀ» À§ÇØ, ÀúÈñ·Î È®ÀÎÇϽʽÿÀ. >Ư¼º: > ±×°ÍÀº °°Àº º¸ÆíÀûÀÎ ÀÚ·á ȸº¹ ¼ÒÇÁÆ®¿þ¾î¸¦ Áö¿øÇÕ´Ï´Ù --R ½ºÆ©µð¿À, advanced_file_recovery, accessdata ftk ÀÌ¹Ì Àú, winhex, superdatarecovery, 7 µ¥ÀÌÅÍ º¹±¸, ¸®´ª½º ¸®´õ µî > »óÁ¡: À¯Çü ¹øÈ£ | Áö¿ø Ĩ | ¿É¼Ç Å©±â | »ç¿ë ¹æ¹ý | ĨÀÇ ¹Ù´Ú-¿À¸¥ÂÊ ¸®´õ¸¦ ¼±ÅÃÇϽʽÿÀ. | A | EMMC169/153 | 9x11mm 11x10mm 11.5x13mm 12x16mm 12x18mm 14x18mm | Clamshell USB | | A | EMCP162/186 | 11.5x13mm 12x16mm 12x18mm 14x18mm | Clamshell USB | | A | EMCP221 | 11.5x13mm 12x16mm 12x18mm 14x18mm | Clamshell USB | | A | EMCP529 | 15x15mm | Clamshell USB | | | | | | | | | . | Âü°í: ±¸¸ÅÇϱâ Àü¿¡ ÈÞ´ë ÀüÈ ¸ðµ¨ ¹× ¸Þ¸ð¸® ºÎÇ° ¹øÈ£¸¦ È®ÀÎÇϽñ⠹ٶø´Ï´Ù, ´ç½ÅÀº ¼ÒÄÏ ¸ðµ¨¿¡ ÀûÇÕÇÏÁö ¾ÊÀ» °æ¿ì ÀúÈñ¿¡°Ô ¿¬¶ô ÇÒ ¼ö ÀÖ½À´Ï´Ù | ¿©±â¿¡ ¸î ´Ü°è fyr: 1. ÈÞ´ë ÀüÈ ¸ðµ¨ ¶Ç´Â ¸Þ¸ð¸® ĨÀ¸·Î Á¡°ËÇÏ¿© ¿Ã¹Ù¸¥ ¼ÒÄÏ/¸®´õ°¡ ÀÖ´ÂÁö È®ÀÎÇϽʽÿÀ. 2. Á×Àº/¹° ¼Õ»ó Àüȸ¦ ºÐÇØÇϽʽÿÀ, unsolder/¸Þ¸ð¸® ĨÀ» Á¦°ÅÇϽʽÿÀ (ĨÀ» °ú¿ÇÏÁö ¸¶½Ê½Ã¿À) 3. Æеå À§¿¡ Á¢ÂøÁ¦¸¦ û¼ÒÇÏ°í, reballing ¶Ç´Â ´Ù¸¥ ¹æ¹ý¿¡ ÀÇÇÏ¿© ¸î¸î ´©¶ô Æе带 ¿Ï·áÇϽʽÿÀ 4. emmc/emcp ¼ÒÄÏ Æǵ¶±â·Î ±â¾ï ĨÀ» µÎ½Ê½Ã¿À, pc/³ëÆ®ºÏ/ÇÁ·Î±×·¡¸Ó¿¡ ±×°ÍÀ» ¿¬°áÇϽʽÿÀ 5. ½ÇÇà ¼ÒÇÁÆ®¿þ¾î ÃßÃâ µ¥ÀÌÅÍ ´ç½ÅÀÌ ±â¼úÁö¿ø ¶Ç´Â ´Ù¸¥ Áú¹®À» ÇÊ¿ä·Î ÇÏ´Â °æ¿ì¿¡ ÀúÈñ¿¡°Ô ¿¬¶ôÇϽʽÿÀ.
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