|
aHR0cDovL2ZyZWVzaGlwLmNvLmty
- ±Ù¿ø: CN (Á¤Ç°)
- Áõ¸í¼: NONE
- ¸ðµ¨ ¹øÈ£: MIJING 3D
- Item Nam: 3D BGA Rework Stencils Template
- Material: High-end Imported Steel Mesh
- Design: Stepped Groove
- Model Number 2: MJ 3D Reballing Stencil for iPhone
- Features 1: Square Holes Design, Easier to Take Out the Formed Solder Balls
- Features 2: High Success Rate of Planting Tin
- Features 3: Less Tendency of Deformation, Long Service Life
- Features 4: Accuratea Lignment
- Function: BGA Rework, CPU Soldering Repair Tools
- DIY Type: CPU BGA Reballing
- Difference: Thicker than Ordinary Stencils in the Market
- Usage: for iPhone Motherboard, NAND Flash, Touch IC, Baseband Rework
- Advantage: New Patented 3D Tin Plant Steel Net
- Type 2: 3D BGA Tin Planting Steel Mesh
- Application 1: MJ 3D A12 For iPhone 12/12mini/12 Pro/12 Pro Max
- Application 2: MJ 3D A13 For iPhone 11/11 Pro/11 Pro Max
- Application 3: MJ 3D A12-2 For iPhone XS IXR
- Application 4: MJ 3D A12-1 For iPhone X MAX
¿É¼ÇÁ¤º¸[(193)for iPhone 12 series][(175)for iPhone 11 series][(10)for iPhone xr xs][(173)for iPhone XS Max]
Mijing 3D ½É±â ƾ ½ºÆ¿ ¸Þ½¬ iPhone XR/XS/XS Max/11 ½Ã¸®Áî/12 ¹Ì´Ï/12 ½Ã¸®Áî BGA/¸¶´õ º¸µå Àç ÀÛ¾÷ ¼Ö´õ¸µ µµ±¸ Å°Æ® Á¦Ç° Ư¡ »õ·Î¿î ƯÇã ´Ü°è ±×·çºê MJ 3D BGA ÁÖ¼® ½É±â ½ºÅÙ½Ç ¾ÆÀÌÆù ¸¶´õ º¸µå ¼ö¸®. 3D ·¹ÀÌÀú Çü¼º, accuratea lignment, »ç¿ëÇϱ⠽¬¿î. ½ºÅÜ ±×·çºê µðÀÚÀÎÀº ½ºÅÙ½ÇÀÌ icÀÇ ÁÖ¼® µµ±Ý À§Ä¡¿Í ºü¸£°Ô Á¤·Ä ÇÒ ¼ö ÀÖ½À´Ï´Ù. Á¤¿¬ÇÑ ±¸¸Û µðÀÚÀÎÀº Çü¼ºµÈ ¶«³³ °øÀ» ¹ÛÀ¸·Î °¡Áö°í °¡´Â °ÍÀ» ½±°Ô ÇÕ´Ï´Ù. ÀÌ 3D ½ºÅÙ½ÇÀº ´ç½ÅÀÌ »õ·Î¿î ¶Ç´Â Àü¹®°¡ÀÎÁö »ó°ü¾øÀÌ »ç¿ëÇϱ⠽±½À´Ï´Ù. ÁÖ¼®À» ½É±âÀÇ ³ôÀº ¼º°ø·ü, ´ç½ÅÀÌ ´É¼÷ÇÑ ÈÄ¿¡ ¶«³³ °øÀº ÇÑ ¹ø Çü¼ºµÉ ¼ö ÀÖ½À´Ï´Ù. ´Ù±â´É ÁÖ¼® ½É±â °Ã¶ ¸Þ½¬: iPhoneNAND Ç÷¡½Ã, ÅÍÄ¡ IC, ±âÀú ´ë¿ª, ±Û²Ã IC, ¿Àµð¿À IC, Àü¿ø IC, a8/A9/A10A/11/A12/A13/A14 CPU reballing. ÀÌ 3D ½É±â ½ºÅÙ½ÇÀº ½ÃÀå¿¡¼ ÀÏ¹Ý ½ºÅٽǺ¸´Ù µÎ²®½À´Ï´Ù. º¯ÇüÀÇ ´õ ÀûÀº °æÇâÀº ±×°ÍÀÇ »ç¿ë »ýÈ°À» ´õ ±æ ¸¸µì´Ï´Ù.
¿É¼Ç ¿É¼Ç 1: iPhone XS / XR ¿ë MJ 3D A12-1 ¿É¼Ç 2: ¾ÆÀÌÆù ¿¢½º ¸Æ½º¿¡ ´ëÇÑ MJ 3D A12-2 ¿É¼Ç 3: MJ 3D A13 For iPhone 11/11 Pro/11 Pro Max ¿É¼Ç 4: MJ 3D A12 For iPhone 12/12mini/12 Pro/12 Pro Max
Á¦Ç° »ç¾ç ¹°ÀÚ: »óÇÑ ¼öÀÔµÈ °Ã¶ ¸Þ½Ã »ö»ó: ±×¸² ¼î À¯Çü: »õ·Î¿î MJ 3D BGA Reballing ½ºÅÙ½Ç ÅÛÇø´ ¸ðµ¨ ¹øÈ£: »õ·Î¿î ƯÇã 3D ÁÖ¼® °øÀå Reballing ±×¹° µðÀÚÀÎ: ¹âÀº ±×·çºê Á¤Àå: iPhone 6G-12 Pro M °ø±ÞÀÚ: DIYPHONE ½Åû: ¾ÆÀÌÆù6G-12 Pro MaxBGA ¸¶´õ º¸µå Reballing ¿ëµµ: BGA Àç ÀÛ¾÷ µµ±¸ ±â´É: ¾ÆÀÌÆù ³½µå Ç÷¡½Ã, ÅÍÄ¡/Àü¸é/¿Àµð¿À IC, º£À̽º ¹êµå Àç ÀÛ¾÷ DIY À¯Çü: CPU BGA reballing °ø±ÞÀÚ: DIYPHONE
|
|
|
|
|