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- ºê·£µå À̸§: NoEnName_Null
- DIY ¿ëÇ°: Àü±â
- Áõ¸í¼: ¼¼·ý
- ±Ù¿ø: CN (Á¤Ç°)
- ÆÐÅ°Áö: BOX
- À¯Çü: Á¶ÇÕ
- ½Åû: ÄÄÇ»ÅÍ µµ±¸ Å°Æ®
When designing the hardware structure of an electronic product, it is necessary to consider the heating condition of the circuit board during the design, and the design of heat dissipation should also be taken into It is difficult to detect, it is impossible to verify whether the heat dissipation meets the requirements.
In addition, when a radiator or heat pipe is added to the heating device and sealed to the device, whether the temperature can be reduced in a closed environment requires actual data support and can simulate the actual closed environment of the device.
In addition, whether the PCB circuit board uses a good heat dissipation plate and whether it uses a reasonable wiring for heat dissipation needs to be verified.
In the normal R&D process, the circuit board is usually exposed to the air for verification, and the actual effect cannot be verified. And verification through thermal simulation is only software simulation, and it cannot be close to reality.
Our heat dissipation design system was born to solve such a demand.
And can customize different sizes of experimental boxes according to requirements, in order to try to get close to the real product form
Features:
1. The experiment box can actually simulate the maximum temperature rise of the circuit board in the airtight enclosure and the temperature condition in the airtight environment
2. Provide a close-to-real heating experiment environment for products above IP54/IP65/IP67 protection level
3. Replace the traditional probe mode to verify the heating condition of the device
4. The temperature sensor detects the ambient temperature, and the thermal imaging detects the heating of the circuit board components. The combination of the two meets product development
5. It can verify the heat dissipation effect of different heat dissipation materials in a closed environment, which is convenient to optimize the choice of heat dissipation materials and determine the correct model that suits the cooling requirements of the product
6. Changed the previous infrared thermal imaging can not view the internal defects of the circuit board through the shell
7. Provide experimental curve records for easy comparison, and long-term trend data can be established in excel software.
8. The temperature sensor does not need to follow any drive, plug and play, convenient and fast;
9. The observation window reaches 50mm to ensure complete observation of the circuit board in the box;
Specification
Pixel: 260*200
Weight: 2kg
Support system: win10/win7
The remaining detailed parameters are shown in the figure
Package includes: pcb thermal imager*1
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