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- ÀÔÀÚ Å©±â: 10-25 ¥ìmÀÇ
- ±Ù¿ø: CN (Á¤Ç°)
- Model Number: AMTECH RMA-223 UV
- Item Name: PCB BGA Solder Paste Flux
- Flux Type: AMTECH RMA-223 UV
- Function: for Soldering, Reballing of Computer, Phone Chips
- Application: for Phone PCB BGA PGA Reworking
- Features 1: High Viscosity No-clean Flux
- Advantage: Good insulation avoid the pale yellow residue
- Volume: 10CC
- Dimension: 93 x 33 x 23mm
- Features 2: Mixture of High-quality Alloyed Powder
- Adhesive Level: High Viscosity
- Usage: Phone IC Chips Repair Tool
- Features 3: Good Immersion, High Intensity Joint
- DIY Type: Solder Flux Paste
- 100%: New Type, High Quality
- With Booster: Yes
- Length of Booster: 95mm
- With Needle Tip: Yes
- Unit Type: Piece
- Drop Shipping: Support
- Packing: Bag
¿É¼ÇÁ¤º¸[(193)No Needle Squeeze][(175)With Needle Squeeze] ÈÞ´ë ÀüÈ IC Ĩ PCB SMD PGA ³³¶« ¿ëÁ¢ Ç÷°½º 100% ¿ø·¡ AMTECH RMA-223-UV BGA ³³¶« ÆäÀ̽ºÆ® Ç÷°½º Ç÷º½Ãºí ´Ïµé Æ©ºê + ÁÖ»ç±â ¹Ù´Ã
Á¦Ç° ±â´É 100% ¿À¸®Áö³Î AMTECH ÇÁ·ÎÆä¼Å³Î RMA-223 UVBGA ³³¶« ÆäÀ̽ºÆ® Ç÷°½º + ½ºÄûÁî Æ©ºê + ÀüÈ ³³¶«À»À§ÇÑ ¹«·á ¹Ù´Ã ÆÁ. »õ·Î¿î ºê·£µå¿Í ³ôÀº Ç°ÁúÀ» 100%. ÁÁÀº ħ¼ö¿Í °í°µµ °üÀý. ¼ÕÀ̳ª ÇɼÂÀ¸·Î ½±°Ô ¹þ°Ü ³»°í ÀÜ·ù ¹°À» ³²±âÁö ¸¶½Ê½Ã¿À. ±Ý, ±¸¸®, ÀÎ, ûµ¿,»êÈ. Á¶¸³ Áß ¿À¿°À» ¹æÁöÇÕ´Ï´Ù. RMA-223: °íÁ¡µµ ¹«Ã»Á¤ Ç÷°½º, PCB, BGA, PGA Àçó¸®, ÄÄÇ»ÅÍ/ÀüÈ Ä¨ ³³¶«. RMA-223 °íÇ°ÁúÀÇ ÇÕ±Ý ºÐ¸»°ú ¼öÁö ÆäÀ̽ºÆ® Ç÷°½ºÀÇ È¥ÇÕ¹°À̸ç, ¿¶Àº ³ë¶õ»ö ÀÜ·ù ¹°À» ÇÇÇÒ ¼ö ÀÖ½À´Ï´Ù. ³ôÀº ´ã±Ý, °í°µµ °üÀý. ¹«µ¶¼º, ºÎ½Ä¼º, °·ÂÇÑ Àý¿¬ ´É·Â. ÁÁÀº ´Ü¿Àç ¹× ¸Å²ô·¯¿î ¿ëÁ¢ Ç¥¸é. ¿È ¾øÀ½ °ÇÁ¶ ¾øÀ½. µ¶ ¾øÀ½ ºÎ½Ä ¾øÀ½, ºÎÇ° ¼Õ»ó ¾øÀ½. ±×°ÍÀº ÇöÀç ½ÃÀå BGA, CSP Àç ÀÛ¾÷ µµ¿ò¸» ºÙ¿© ³Ö±â¿¡¼ ÃÖ°íÀÔ´Ï´Ù.
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Ç÷°½º ŸÀÔ: ¿À¸®Áö³Î AMTECH RMA-223 UV (¹Ì±¹»ê) ºÎÇÇ: 10ml/10cc Ä¡¼ö: 93x33x23mm Àç·á:°íÇ°ÁúÀÇ ÇÕ±Ý ºÐ¸»°ú ¼öÁö ÆäÀ̽ºÆ® Ç÷°½ºÀÇ È¥ÇÕ¹°Àº ¿¶Àº Ȳ»ö ÀÜ·ù ¹°À» ÇÇÇÒ ¼ö ÀÖ½À´Ï´Ù. »ö»ó: ¹«»ö/Åõ¸í Àý¿¬: ¿¹ ¹Ù´Ã ÆÁ: ¿¹ Á¦ÀÛ: ¹Ì±¹ ¸¹Àº #: 111-06-01 ½Åû:ÄÄÇ»ÅÍ ¹× ÀüÈ Ä¨ÀÇ ³³¶« ¹× Àç°áÇÕ ¿ë. ÀåÁ¡:ÁÁÀº ħ¼ö¿Í °í°µµ °üÀý. ±â´É:PCB , BGA , PGA Àç ÀÛ¾÷ ¿ë. 100%: »õ·Î¿î À¯Çü, °íÇ°Áú. ¼ö·®: 1 °³/2 °³
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