|
aHR0cDovL2ZyZWVzaGlwLmNvLmty
- ÀÔÀÚ Å©±â: 1-10 ¥ìmÀÇ
- ¸ðµ¨ ¹øÈ£: solder paste welding flux
- ºê·£µå À̸§: AMTECH
- ±Ù¿ø: DE (¿ø»êÁö)
- Viscosity: 75
- activity: Weak acidity
- Lead-free halogen: yes
- model: HO-321-CHIP
- Granularity: 10
- Scope of application: Repair of BGA chip ball
- Cleaning angle: Selectivity
- melting point: 70
- Working temperature: 250
- processing and customization: yes
- Type: Rosin-free high resistance
- low smoke: no rosin
TEAC HO-321-Ĩ ¼Ö´õ ÆäÀ̽ºÆ®, ¼Ö´õ ÆäÀ̽ºÆ®³·Àº ¿¬±â ¾øÀ½ ·ÎÁø´Ïµé Æ©ºê ¼Ö´õ¸µ ÆäÀ̽ºÆ® Ç÷°½º ¼Ö´õ¸µ ÆäÀ̽ºÆ®, ¼Ö´õ¸µ Ç÷°½º ¸ÞÄ«´Ð ¼Ö´õ¸µ ÆäÀ̽ºÆ®
HO-321-Ĩ
1, HO-321-CHIPHalogen-freeEnvironmental Ä£ÈÀû ÀÎ ¼Ö´õ Àú¿Â ¹ÝÅõ¸í, ÆäÀ̽ºÆ®´Â ÀúÇ×¼ºÀÌ ³ô°í Àü±â¸¦ ´©ÃâÇϱ⠽±Áö ¾Ê½À´Ï´Ù. ±×°ÍÀº °¡Á¤ ¹× ÇØ¿Ü Àü¹® »ç¿ëÀÚ¸¦ À§ÇØ Æ¯º°È÷ ¸¸µé¾îÁø Àü¹® ÆäÀ̽ºÆ®ÀÔ´Ï´Ù. ¶ÇÇÑ ¹ë·ù º¼, ¼ö¸® (ÀϹÝÀûÀ¸·Î ³ë½º »ç¿ì½º ºê¸´Áö¿¡ »ç¿ë), ÈÞ´ë ÀüÈ chipCPU SocketValue balland ³³¶« ÀεΠ¹× ÁÖ¼® ¿ëÁ¢ µî.
2 º¼ÀÇ ³ÐÀº ¸éÀûÀÇ ¼öµ¿ ºê·¯½Ì (Ĩ ÂüÁ¶), ¿ëÁ¢ ÈÄ ¼±Åüº û¼Ò.
3, µµÆ® ¸ÅÆ®¸¯½º ¹ë·ù º¼ (¿¹: ÄÄÇ»ÅÍ ¸¶´õ º¸µå dcpu ¼ÒÄÏ) ¿¡ »ç¿ë, ¿É¼Ç û¼Ò.
4, ¿ëÁ¢ ÈÄ ÀÜ·ù ¹°Àº Åõ¸íÇÏ°í, ƾ º¼Àº ¹à°í, ÇҷΰÕÀ» Æ÷ÇÔÇÏÁö ¾Ê½À´Ï´Ù (F / CL / Br / I) Àç·á ¹× ±âŸ ÀåÁ¡.
5, ÆäÀ̽ºÆ®ÀÇ Á¡µµ´Â Àû´çÇÏ°í ÀÔÀÚ Å©±â´Â ÀϹÝÀûÀ¸·Î 2-5μm ÀÔ´Ï´Ù. ¼öµ¿ ºê·¯½Ã ¹× ÀÚµ¿ Àμ⿡ ÀûÇÕÇÕ´Ï´Ù.
6, ¸®ÇÃ·Î¿ì ¿ëÁ¢ ¹× ¼öµ¿ ¹ë·ù º¼ ¹× ±âŸ ÇÁ·Î¼¼½º ¸ðµÎ¿¡ Àû¿ë ÇÒ ¼ö ÀÖ½À´Ï´Ù.
Á¦Ç° ÁÖ¿ä ¼ººÐ: ¼öÀÔ È°¼ºÁ¦, À¯±â ¿ëÁ¦, ÁõÁ¡Á¦, ¹æºÎÁ¦ µî
°ü·Ã Á¤º¸: MSDS µ¥ÀÌÅÍ, SGS º¸°í¼.
|
|
|
|
|