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aHR0cDovL2ZyZWVzaGlwLmNvLmty Item specifics - is_customized:
- Yes
- Brand Name:
- unbranded
- Model Number:
- Sn99Ag0.3Cu0.7
Packaging Details - Unit Type:
- piece
- Package Weight:
- 0.200kg (0.44lb.)
- Package Size:
- 10cm x 5cm x 4cm (3.94in x 1.97in x 1.57in)
p> 100g Lead Free Solder Paste Syrnge Solder flux paste - Sn99Ag0.3Cu0.7 Instructions: It is designed disposable production technology for today\'s SMT type of a no-clean solder paste, solder paste using a special soldering paste and oxide content and a small ball made of tin powder refining. Excellent continuous printing . In addition, this product contains more flux, with high reliability, low ionic activator system, so that it possessed very little residue after reflow very high insulation resistance, with high reliability. 1. Sorts and Chemical compositions Sort | Chemical composition (wt.%) | Sn | Pb | Sb | Cu | Bi | Ag | Fe | Al | Cd | Sn99Ag.3Cu0.7 | 99±0.5 | < 0.01 | <0.01 | 0.7±0.2 | <0.01 | 0.3±0.1 | <0.02 | <0.002 | <0.002 |
2. Physical Speciality Specification | (C) Melting Point | g/cm3 Spec. Gravity | MPa Tensile Strength | Sn99-Ag0.3-Cu0.7 | 217-227 | 7.40 | 51.3 |
5. Application: adapt to a variety of electronic circuit boards installed linking the various sectors of lead-free soldering processes. adapt to various components of immersion tin or lead-free solder. but also for a variety of special welding process. 6. Specifications: Alloy: Sn99Ag0.3Cu0.7 Powder Specifications: 3 powder Melting point :217-227 degrees. Stream support system: fine pitch, high-speed printing. Packing: 100g / Syringe
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